• Currently Configured for 200mm Wafers
• Original Ship Date: 1996
• Previously Used for Tungsten Polish
• 676 Mainframe with Operator Interface Monitor
• System Computers – SysCon(1), Polish Heads(4), Endpoint (1), C2C(1)
• Advantgaard 676 3.0 rev S System Software
• Brookside Endpoint Detection System with Configurable Algorithm to Detect Endpoint
• 4 Mechanical polishing heads with Advanced Pad Motion
• 3 Systolic Pumps for Slurry or DI Water
• High Flow DI Water Rinse Valve Configuration
• Upper and Lower Pneumatics Panel
• Hoist for Upper Motor and Tower Removal
• 2 Pad Conditioning Systems
• Cassette to Cassette Wafer Handling System
• Genmark Gencobot Multi-Axis Robot with Wafer Pickup Paddle
• Wet Cassette Assembly with Wafer Sensor Array
• Spray Box Assembly
• Electrical Cabinet with Computer Control Station