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IPEC/SpeedFam 776 Dry-in Dry-out CMP (S/N: 776-018)

• Currently Configured for 200mm Wafers
• Original Ship Date: December, 1997
• Previously Used for Oxide Polish
• Three Cassette Input Station
• Integrated 7700 Cleaning Station
o Equip Robot with Wafer Sensor
• 4 Mechanical polishing heads with Advanced Pad Motion
• 2 Bladder Style Diamond Pad Conditioners
• Slurry Flow Monitor Kit; NT Flow Meters
• Slurry Delivery Pumps
o 17-21 Input and Output
o Upgraded to New Gray Quick Disconnect
• Jacking Towers Upgraded to Hex Head Bolts
• Base Upgraded to New Style Leak Detectors
• Plumbing Utilizes the Ultra Pure (Flare) Fittings
• Upper and Lower Pneumatics Utilize Swage Lock Fittings in all Applicable Areas
• SECS/GEM Integration
• Electrical Requirements: 208V, 60Hz, 5 Phase